Support Telecomtalk
Andrew Bonwick
Vice President of Product Development at Relm Insurance
Madhav Sheth
CEO of Ai+ Smartphone
Stephen Rose
CEO Render Networks
Taiwanese company MediaTek has launched its latest flagship mobile chipset family, the Dimensity 9400+, featuring generative artificial intelligence (GenAI) and agentic AI capabilities. Designed to deliver high performance and next-generation AI functionality, the new SoC supports the latest large language models (LLMs) while maintaining a highly power-efficient design, the company announced on April 10, 2025.
- Make Telecom Talk My Trusted Source
Also Read: MediaTek Unveils M90 5G-Advanced Modem With AI and Speeds Up to 12 Gbps
All-Big-Core Architecture
The Dimensity 9400+ features an All Big Core architecture, integrating one Arm Cortex-X925 core clocked at 3.73GHz, alongside three Cortex-X4 cores and four Cortex-A720 cores. This configuration promises enhanced single- and multi-threaded performance, tailored for premium Android UX experiences, according to the company.
“The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalised AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease,” said JC Hsu, corporate senior vice president at MediaTek.
Hsu added that “MediaTek is working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring a number of speed and privacy benefits to consumers.”
The chipset is equipped with MediaTek’s NPU 890, enabling support for a broad range of large language models (LLMs). Key AI advancements include Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing.
Also Read: MediaTek to Launch More Affordable 5G Chipsets for Indian Market: Report
