Huawei launches Nova, world’s first 16nm FinFET 64-Bit networking chip

Huawei has unveiled world’s first processor based on 16nmFinFET technology, known as Nova. It is basically a networking processor, which supports different bands such as GSM/UMTS/LTE FDD/LTE TDD on a single chip. It is based on ARM64 architecture and the 16FinFET process. Huawei also claims it to be 67% more efficient than regular processors as it offers enhanced performance and flexibility.

Nova is integrated with high quality board, which simplifies the site configuration and decreases power consumption, as touted by the company. Moreover, Huawei has also announced the world’s primary L-band antenna, which supports Ultra Wide Band (UWB) and multi band. It also supports premiere frequency bands at 700/800/900/1800/2100/2600MHz. The L-band also enables the 1500 MHz band.

Huawei-Nova

Commenting on the announcement, Wang Jun, President of the SingleRAN & FDD Product Line, Huawei Wireless Network Product Line said, “The launch of Nova is testament to Huawei’s continued leadership and innovation in the ICT industry. Along with enabling the most advanced mobile network, Nova will provide customers access to the very best mobile broadband experience,” he said.

Huawei will be showcasing this chip at the Mobile World Congress, next week. Having said that, we have been witnessing a lot of innovation in the mobile chips arena lately. Interestingly, Samsung’s upcoming flagship will also be powered by the company’s latest 14nm Exynos processor, which will be the first ever processor built on the 14nm technology in the smartphone market, and now Huawei has also come with an innovative networking chip. Although, there is no relation between these two chips as one is a mobile chip and other is a networking chip, but it is a hint that we will be witnessing more of these at the MWC this year.

Reported By

Leave a Reply

1 Comment on "Huawei launches Nova, world’s first 16nm FinFET 64-Bit networking chip"

 

Sort by:   newest | oldest
jack
February 25, 2015 10:51 pm 10:51 PM

Good to see that companies are reducing IC size…so devices will become more slim…hope they r dealing with heat problems neatly….?

wpDiscuz