A day after Qualcomm announced Snapdragon 845 Mobile Platform, the company revealed more details of the processor that will show up in flagship smartphones early next year. The chipset will retain the 10nm architecture as 2017’s SD 835 but will come new features like improved AI features, camera enhancements, and security.
The Snapdragon 845 comes with octa-core architecture using four performance ARM A75 cores running at a speed of up to 2.8GHz and four efficiency ARM A55 cores that run at a speed of up to 1.8Ghz. There is a new graphics processor called Adreno 630 that offers up to 30 percent more performance while gaming compared to the Adreno 540.
Here are all the improved features that SD 845 will bring to 2018 flagship smartphones:
Qualcomm said Snapdragon 845 is Qualcomm’s third generation mobile AI platform, something which began with the 820. The new enhancements will deliver three times faster performance over the Snapdragon 835 when it comes to neural processing tasks.
This will also enable AI improvements in several features from photography, security to digital assistants. The AI will get your more secure face unlock feature, and as well artificial bokeh effect with a single camera. It would boost the accuracy of digital assistants that can pick your voice out over others around you and respond to only you in natural, conversational manner.
The Snapdragon 845 now comes with new Spectra 280 ISP (image signal processor) which is set to improve the quality of camera results. The new chip supports a wider colour gamut and 10-bit colour depth that will capture 64 times more colour volume than the previous generation SoC. It will also bring better low-light photography by allowing multi-frame processing.
The Snapdragon 845 is the first chipset to capture 4K Ultra HD Premium video in HDR at 60 frames per second. You also get built-in support for slow motion HDR10 videos shot up to 720p at 480 frames per second and 1080p videos at 240 frames per second. With these improvements, Qualcomm expects to score 100+ on the DxO camera benchmark test, the first time any phone will have hit triple digits.
Snapdragon 845 also brings improvements in mobile security. Qualcomm has added a “Secure Processing Unit” which acts as a vault or island to store your most personal biometric data such as fingerprint, iris, voice, and facial information. This has its own processor, memory, and power, segregating from OS environment. Also, the 845 supports 3D face mapping and uses up to 50,000 dots of infrared light to map your face which brings Face Unlock feature at par with Apple’s.
Another key upgrade as with each year is better power efficiency. Qualcomm says the Adreno 630 GPU provides 30% better battery efficiency than previous SoC. You also have Qualcomm Quick Charge 4+ to top up your device even faster. Qualcomm promises 50 percent of a full charge of your device in just 15 minutes.
Qualcomm has integrated a new X20 LTE modem into SD 845. This will support download speed of up to 1.2gbps, 20 percent higher than what the Snapdragon 835 offered. However, the high-speed Gigabit LTE network is limited to just 20 odd countries.
WiFi has also been enhanced, with support for two modules to prevent a drop in coverage, if your hand is blocking signal to one. There is 30 percent more efficient WiFi performance with 16 times faster connection speed.
Bluetooth connectivity is improved too. The TrueWireless Bluetooth 5 system now allows you a single device to broadcast audio to multiple speakers or headphones simultaneously. The company also says this system can provide a 50% improvement in power consumption for truly wireless headphones.
The first devices to pack Snapdragon 845 will arrive in early 2018, so it will be awhile before we get to see what all the new features in real life. It will likely appear on devices like Samsung Galaxy S9, Google Pixel 3, OnePlus 6 and more. It is also power new Windows 10 laptops by the end of the year. Xiaomi confirmed that the Mi 7 will be powered by the Snapdragon 835 itself.