MediaTek Unveils Dimensity 9200+ Chipset for Flagship 5G Smartphones

MediaTek

MediaTek, a leading Taiwanese semiconductor company, has announced the launch of its new Dimensity 9200+ chipset, designed to power flagship 5G smartphones. The Dimensity 9200+ is the latest addition to MediaTek’s Dimensity portfolio, building on the success of its predecessor with improved performance and power efficiency, ideal for longer battery life and superior gaming experiences.

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The Dimensity 9200+ combines an ultra-core Arm Cortex-X3 operating at up to 3.35GHz, three Arm Cortex-A715 super-cores running up to 3.0 GHz, and four Arm Cortex-A510 efficiency cores at 2.0 GHz. The chipset boasts a 17% boost to its Arm Immortalis-G715 GPU, providing an additional boost for gaming and other compute-intensive applications.

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The Dimensity 9200+ is equipped with HyperEngine 6.0, which enhances the gaming experience with adaptive performance technology, enabling sustained high frame rates and minimising latency. The chipset’s Sixth-generation AI Processing Unit (APU 690) efficiently powers AI-noise reduction and AI-super resolution tasks, creating cinematic videos through real-time focus and Bokeh adjustments. The MediaTek Imagiq 890, a powerful flagship image signal processor, supports captivating capture, providing bright, sharp images and videos even in low-light scenarios. The chipset also features MediaTek MiraVision 890 display technology with adaptive refresh rate technology and motion blur reduction for a fluid user experience.

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The Dimensity 9200+ is built using the second-generation TSMC 4nm-class process, making it ideal for ultra-slim designs in various form factors. Furthermore, the chipset boasts MediaTek 5G UltraSave 3.0 power efficiency technologies, which optimise battery life for all 5G connection conditions.