Supposed claims from a case maker in China seems like a confirmation of the design of HTC’s upcoming One (M9) flagship. The photos of the One M9 have leaked several times in the past few days.
As shown in the image above, one can clearly see the distinctively shaped camera of the upcoming device. The phone is expected to pack in a 20.7-megapixel sensor.
The case design also shows that the power/lock key button of HTC Hima is placed on its right side while the HTC One (M7) and One (M8) had it placed on top. The case opening on top in the photos will most likely help in the working of IR blaster (Infrared blaster).
HTC One (M9) will be launched on March 1 during Mobile World Congress (MWC), which will be held in Barcelona. The leaked specs of the One M9 include Qualcomm Snapdragon 810 SoC, 3GB of RAM, 5-inch 1080p display and a 20.7-megapixel camera.
