MediaTek’s Latest Helio P22 SoC is Built on 12nm FinFET Process and Has Bluetooth 5.0 Support

MediaTek, the chipset company which is currently riding high on the Helio P60 chipset success has now announced the launch of Helio P22 chip. The Helio P22 SoC takes a lot of features from its bigger sibling Helio P60 chipset. Firstly, the chipset is built on 12nm manufacturing process which is a first in the lower mid-range segment. MediaTek says that with the P22, it offers the benefits of AI, advanced photography, high-speed connectivity options to even more affordably priced devices. MediaTek also confirmed the Helio P22 is in volume production at the moment and is expected to be available in consumer devices by the end of Q2 2018. The first manufacturers to make use of the new chipset would be Oppo and Vivo.

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MediaTek Helio P22 Features
As mentioned, the MediaTek Helio P22 is built with TSMC’s 12nm FinFET technology, which was also used to manufacture the Helio P60. So the chipset will deliver exceptional battery life, keeping the performance top-notch at the same. It has an octa-core CPU with eight Cortex A53 processors operating at a maximum clock speed of 2.0 GHz. This means the chipset will offer sustainable high CPU performance while requiring low power inputs.

The Helio P22 also comes with various new photography and faster connectivity options. For starters, the Helio P22 also supports dual 4G connectivity in both the SIM cards, same as the Helio P60. Other connectivity options include Wi-Fi 802.11ac, Bluetooth 5.0 and the 4-Satellite system GNSS makes up for faster, more efficient & accurate connectivity locally and globally.