Andrew Bonwick
Vice President of Product Development at Relm Insurance
Madhav Sheth
CEO of Ai+ Smartphone
Stephen Rose
CEO Render Networks

Qualcomm will launch the upper mid-range Snapdragon 670 SoC very soon. Rumours say that the chipset will see the light at the MWC 2018 event itself. But before that, complete specifications of the chipset surfaced online suggesting it as the powerful Snapdragon mid-range chipset until now. The report highlights that Snapdragon 670 SoC will be built on 10nm manufacturing process and will have an octa-core CPU. It will arrive with Snapdragon X2X modem that is expected to deliver download speeds of up to 1 Gbps.

The Snapdragon 660 SoC is already the most powerful mid-range chipset available in the market, and the Snapdragon 670 SoC will exceed the expectation. To be noted, it will be first Snapdragon chipset to be built on the 10nm manufacturing process. This entire information is revealed by popular tipster Roland Quandt on Twitter.
Qualcomm Snapdragon 670 SoC Rumoured Specifications
Talking about the specifications of the upcoming Snapdragon 670 SoC, it won’t be based on the classic big.LITTLE architecture as Qualcomm is looking to add a hexa-core processor and a dual-core processor.
The hexa-core processor will be of low-end while the dual-core processor will be of high-end. The former will have Kryo 300 Silver cores with a maximum clock speed of 2.6GHz, and the latter will have Kryo 300 Gold cores. That said, the Kryo 300 Silver is a slightly modified version of Cortex A55, whereas the Kryo 300 Gold is a different version of Cortex A75. Also, the high-end dual-core chip will have a maximum clock speed of 1.7GHz.