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MediaTek has announced that it has developed a 3nm chip using TSMC’s technology. It is the first 3nm chip from MediaTek and it will empower the Dimensity series chips to deliver a more powerful experience to consumers. In a release, the company said that it expects to produce the 3nm Dimensity chips in high volume from 2024. 3nm chips are the future for flagship smartphones as they would not only be able to deliver more power but will also be more energy efficient.
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“We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
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Compared to the N5 process, the 3nm tech is 18% faster using the same amount of power or 32% less power-consuming at the same speed. This means that the smartphone experience for the users is going to reach a new height with the 3nm chip from MediaTek. The Dimensity chips from MediaTek already power a lot of smartphones and tablets in the flagship range today. This development will certainly put MediaTek in the eyes of OEMs (original equipment manufacturers) who are planning their next flagship product.
