Samsung Announces New Multi-Chip Package for 5G Phones

The South Korean tech giant Samsung has just announced a new multi-chip package (MCP) for 5G smartphones. This is Samsung’s effort in improving the customer experience by offering better performance speeds to the next-generation smartphones. According to an IANS report, Samsung has already started mass producing low-power double data rate 5 (LPDDR5) UFS (universal flash storage) MCP that will integrate NAND flash memory chips and DRAM in a single package. This is bound to improve the performance of smartphones quite significantly.

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Samsung’s LPDDR5 Mobile DRAM Can Read/Write at 25 Gbps

The biggest highlight of the LPDDR5 mobile DRAM from Samsung is just how fast its read and write speed is. In comparison to the LPPDR4X, the LPDDR5 mobile DRAM from Samsung is 1.5 times faster. Samsung’s LPDDR5 mobile DRAM can read and write at a speed of 25 Gbps. This, coupled with the UFS 3.1 NAND flash (3 Gbps speed), which is double the speed of the earlier UFS 2.2 solution, will provide the smartphones with more power and enhance their performance.

The South Korean tech giant will be offering multiple solutions and storage capacity configurations to its customers with diverse needs. Samsung will be offering DRAM ranging from 6GB to 12GB and NAND flash ranging between 128GB and 512GB.

According to a report from Yonhap news agency, Samsung’s LPRDD5 uMCP will enable users to consume high-quality 5G content services if they are in a stable condition even with a low-tier 5G smartphone.