Sony Xperia H8266 With Snapdragon 845 SoC and 4GB RAM Benchmarked, Expected to Launch at MWC 2018

Sony intends to unleash its new set of flagship smartphones at Mobile World Congress in Barcelona. Though the company has not officially announced any of the phones, a new Sony Xperia phone with model H8266 appeared on AnTuTu benchmark. The benchmark details some of the key specifications of the device. The benchmark reveals the Sony H8266 features an FHD+ display with 2160 x 1080 pixel resolution. This also means the smartphone will be offering an aspect ratio of 18:9. The Japanese tech giant finally seems to be ditching its OmniBalance design to embrace the trendy full-screen design.

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Under the hood, Qualcomm’s top range system-on-chip, the Snapdragon 845 will be power the H8266. The high-end chip is backed by 4GB of RAM and 64GB of internal memory, presumably expandable via a microSD card. The benchmarked device also shows Android 8.0 Oreo meaning the alleged smartphone will run Oreo out-of-the-box.

The H8266 was previously spotted in the Geekbench database, having run the well-known benchmark. The device achieved a whopping 2393 score in the single-core test, and 8300 for multi-core. The listing confirms the model is powered by Snapdragon 845 paired with 4GB RAM and runs Android 8.0 Oreo.

Previous leaks hint the Sony H8266 will feature dual 12MP camera module on the rear and a 15MP selfie shooter. The device is backed by a 3,240mAh battery with Qnovo Adaptive Charging Support. The said smartphone is also IP68-certified, meaning it is dust and water resistant.