Qualcomm announced on Thursday its collaboration with Indian original design manufacturers (ODMs), including VVDN, Tessolve, Teksun, and Innominds, to accelerate the rollout of Edge Artificial Intelligence (AI) applications, including support for the 5G sector, as reported by ET. This announcement from Qualcomm comes on the sidelines of IMC2024.
Also Read: Qualcomm Launches Wireless Networking Platform With Wi-Fi 7 and Edge AI
Key Features of Edge AI Box Solutions
Qualcomm reportedly said its Edge AI Box Solutions offer scalability, ease of use, and performance to meet the demands of industrial and commercial Internet of Things (IoT) applications. Key areas of focus include security and surveillance, factory safety, traffic flow management, energy resource management, video collaboration, real-time data insights, and more.
By working with ODMs, Independent Software Vendors (ISVs), and System Integrators (SIs), Qualcomm plans to enable customers to efficiently deploy tailored, pre-designed solutions.
"Our edge AI solutions bring together the industry's leading technologies across powerful computing, innovative edge AI processing, power efficiency, reduced latency, latest 5G and Wi-Fi connectivity, crystal-clear video and more to fuel the next-generation of resilient, high-performing IoT applications," the report quoted Suri Maddhula, VP of IoT Solutions Product Management at Qualcomm Technologies.
Also Read: Aprecomm Partners with Qualcomm to Enhance AI-Powered Wi-Fi Optimisation
Partnership with STMicroelectronics for IoT Solutions Powered by Edge AI
In another development earlier in October, Qualcomm and STMicroelectronics announced a strategic collaboration to develop industrial and consumer IoT solutions leveraging edge AI.
This partnership will see the two companies integrate Qualcomm Technologies' AI-powered wireless connectivity technologies, starting with a Wi-Fi/Bluetooth/Thread combo system-on-a-chip (SoC), into the microcontroller (MCU) ecosystem from ST.
Through this collaboration, developers will benefit from seamless connectivity software integration into STM32 general-purpose MCUs, including software toolkits, facilitating quick and broad adoption via ST's worldwide sales and distributor channels, the companies said on October 1, 2024.
