Recently, Qualcomm has disclosed that a “large company” has decided not to use the Snapdragon 810 in an upcoming flagship. Interestingly, all the hints are pointing towards none other than Samsung. The reason behind this change is Snapdragon 810’s alleged overheating issues, which Samsung encountered in its tests of the chip. The question that arises from the withdrawal is, why did Samsung encountered problems and not LG? As known by many, LG has come across herculean challenges while developing the G Flex 2 with Snapdragon 810.
However, despite the denial regarding the overheating issue, LG has admitted at a conference held in South Korea, that it had faced various troubles with the “initial batch” of the Snapdragon 810 chipsets. Thankfully, LG and Qualcomm have worked on the issues, which turned everything on schedule for the release of both LG G Flex 2 and the upcoming LG G4.
Taking about the G4, LG was also quizzed on the packaging of the phone and if it will feature a metallic body. As expected, LG tackled the question in an irrational way, it said,“these decisions will be based on market demand.” Keeping in mind that now-a-days many Original Equipment Manufacturer (OEMs) are shifting to the metal body for flagships, which speaks volumes about the demand of metal bodied devices in the market.
Now returning to the subject of the news, Snapdragon 810 chipset overheating. Assuming that LG is being absolutely honest about the matter, which also means that other OEMs that are anticipated to still integrate the Snapdragon 810 (like HTC) might not face any delays either. We hope everything stays on schedule, for the welfare of OEMs, Qualcomm and also the customers who simply want to have the latest devices without any delay.
What do you think of the “Snapdragon 810 wreck” on the grounds of what we know till now? Will it affect Qualcomm’s reputation in the long term? Let us know through your awesome comments!
