MediaTek, a semiconductor giant, has added a new chip to the Dimensity 7000 series chips family. It is the MediaTek Dimensity 7100 SoC, and it is built on the 6nm process. The chipset has an eight-core CPU setup. There are four Cortex-A78 performance cores clocked at up to 2.4 GHz and four Cortex-A55 efficiency cores running at 2 GHz. The graphics of the chip are handled by the Arm Mali-G610 GPU, which is up to 8% faster than the GPU in the Dimensity 7050.
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The chip has support for LPDDR5 RAM at speeds of up to 5500 Mbps and also supports 3.1 internal storage. The Dimensity 7100 is 5% more power-efficient during the app usage, and up to 16% more efficient in multimedia playback, the company said. On the modem side, the chip is 23% more efficient. The comparison is of course to its predecessor. There's also the use of MediaTek's UltraSave 3.0+ on the chip to ensure that battery drain during extended 5G sessions can be avoided.
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The chip supports connectivity for Wi-Fi 6 and Bluetooth 5.4. There's also support for 10-bit colour depth and HDR video playback. The chip further supports 200MP camera along with HDR imaging, multi-frame noise reduction, and harware accelerated face detection. The chip will also support 45W fast-charging and the UFCS universal charging protocol.
